STILETTO SERIES HV MAGNETRON SPUTTERING SOURCES
Stiletto Series Circular Magnetron Sputtering Sources
AJA Stiletto Series Circular Magnetron Sputtering Source는 월드 클래스의 A300-XP 시리즈 UHV 소스의 유연한 기능을 유지하면서, 고진공 응용 분야를 위한 박막 연구 커뮤니티의 가장 까다로운 요구를 충족하도록 설계되었습니다. Circular Target Stiletto Source는 다음 크기로 제공됩니다:
- ST10: 1.0" Target Ø
- ST15: 1.5" Target Ø
- ST20: 2.0" Target Ø
- ST30: 3.0" Target Ø
- ST30-MM: 3.0" Ø Magnetic Target
- ST40: 4.0" Target Ø
- ST40-MM: 4.0" Ø Magnetic Target
on 12" HV mounting stalks with UBQD Option
Shown with 4" Fe target on integral jacking platform for easy target exchange.
Stiletto Series Rectangular Magnetron Sputtering Sources
AJA Stiletto Series Rectangular Magnetron Sputtering Source는 월드 클래스의 A300-XP 시리즈 UHV 소스의 유연한 기능을 유지하면서, 고진공 애플리케이션을 위한 박막 연구 커뮤니티의 가장 까다로운 요구 사항을 충족하도록 설계되었습니다. Rectangular Target Stiletto Source는 다음 크기로 제공됩니다:
- ST1550: 1.5" X 5.00" Target
- ST1580: 1.5" X 8.00" Target
- ST2056: 2.0" X 5.63" Target
- ST2080: 2.0" X 8.00" Target
Custom Configured for Facing Target Deposition with adjustable spacing.
On 1.5" OD support for compression seal mounting.
End Mounted ST1580 - For Coating Inside Tubes
Coating inside tubes can be difficult since most sputter sources are too large and not end mounted. AJA has developed low profile, rectangular magnetrons for 5" and 8" long targets.with long support tubes. By inserting the source into the end of a rotating, tubular substrate and moving either the source or the substrate in a linear fashion, the inside of the tube can be uniformly coated. AJA also has custom designs for small conical target units for tubes as small as 2" in diameter.
Unique Modular Magnet Array
AJA's magnetron sputtering sources feature a unique "modular magnet array" which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits access to the internal magnet arrangement thus allowing the same source to be:
- Operated as a balanced magnetron
- Configured for maximum target utilization
- Configured for high or low rate sputtering
- Operated in a variety of unbalanced magnetron configurations
- Changed for uniform or intentionally non-uniform depositions
- Configured for high or low electron energies as they arrive at the substrate surface
- Operated with thick magnetic material targets
- Optimized for easy magnetic target removal and replacement
Typical Features
- Modular magnet array isolated from cooling water
- Magnetic material sputtering of thicker targets
- Easy removal of larger magnetic targets
- Integral gas injection and chimney system
- Efficient target cooling with no vacuum/water seals
- Clamped target mounting for optimal heat transfer
- RF & DC compatibility
- Rugged HV construction
- Operating pressure: (0.3 mTorr - 1.0 Torr)
- In-situ tilt or manual tilt for optimum uniformity
- Custom versions available
- Source/power supply/target packages available
Typical Applications
- CD/DVD disk coatings (e.g. reflective, phase change)
- Semiconductor
- Conductive metal / Resistive metal / Insulating films
- Transparent electrical conductors (e.g. ITO)
- Optical communications applications (e.g. pump lasers)
- Wear resistant films
- Lens coatings (reflective / anti-reflective / hard / color)
- Precious metals (for maximum target utilization)
- Thin film sensors
- Coatings for surgical/medical implements & implants
- Magnetic storage media and heads (HD, GMR , TMR)
- Photovoltaic thin films (solar cells)
