Advanced Thermal ALD for 8-Inch Substrates

The AT810 is the most cost-effective thermal ALD tool on the market. 

For larger-scale applications, the AT810 supports 8-inch substrates and offers advanced thermal ALD capabilities. Its customizable features make it suitable for batch processing and complex sample geometries.

• Small Footprint Desktop System

• Semiconductor-grade metal sealed lines and high temperature compatible fast pulsing ALD valves.

• Ultrafast MFC for integrated inert gas purge.

• 8″ circular chuck customizable for smaller sizes or other shapes.

• 3 organometallic precursors and 2 (up to 3) counter reactants.

• Heated lines throughout (from precursor to chamber).

• All aluminum (semiconductor grade) chamber ‒ range up to 300°C

• 7” touchscreen PLC controller (no PC required).

Features

• Small Footprint Desktop System, cleanroom compatible.
• All aluminum (semiconductor grade) chamber ‒ range up to 300°C
• High temperature semiconductor grade fast pulsing ALD valves with ultrafast MFC for integrated inert gas purge.
• 8″ circular chuck customizable for smaller sizes or other shapes.
• Streamlined chamber design and small chamber volume
• 3 organometallic precursors and 2 (up to 3) counter reactants.
• Precursors can be heated to 150°C.
• Heated lines throughout (from precursor through to chamber).
• Simple system maintenance and lowest utilities and precursor usage on market
• High exposure (for trenches and porous substrates) and static processing mode
• 7 ” touchscreen PLC controller (no PC required)

Specification

• Chamber temperatures from RT to 300°C ± 1°C
• Precursor temperatures from RT to 150°C ± 2°C (w/ heating jacket)
• Smallest footprint on market, bench top installation and cleanroom compatible
• Simple system maintenance and lowest utilities and precursor usage on market
• Streamlined chamber design and small chamber volume
• Fast cycling capability and high exposure, deep penetration processing available
• All metal sealed from precursor to chamber.
• Typical Operating Pressure
• Full HW and SW interlocks for safe operation in multi-user environment
• 110 – 220 VAC, single phase, 50/60Hz, 15 Amp (10A for 220V)
• Weight approximately 100lbs (45 kgs)

Options

• Customized chuck/platen (square, indents for smaller pieces, powders)
• Customized chamber (thicker substrates)
• ATOzone – Ozone generator (required for some films: Pt, Ir, SiO₂, MoO₂, high quality Al₂O₃ below 60°C, high quality HfO₂)
  • Optional – Ozone Safety Monitor w real time detection of ambient ozone gas
• QCM (Quartz Crystal Microbalance)
• Glovebox integration (typically required to not expose substrate to moisture; Sulfides, etc..)
• External control – PC/software link (allows programing and running, remotely)
• Ventable Precursor cabinet
• Spare Chamber
• IGPA (inert gas pressure assist)for low vapor pressure precursors
• Higher temperatures on precursors (to 180°C)
• Third counter reactant
  • Software control of third counter reactant

Installatiion

• For detailed instructions see our presentation and video instructions: “AT810 Installation and Start-up“

• N₂ purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed), .
  • Input line is 1/4 female VCR compression fitting
  • Attach > 99.9995% nitrogen (UHP) purge gas via 1/4″ metal line to the 1/4″ compression fitting on back
• Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene  tubing or metal line to the other 1/4″ compression fitting marked CDA (Clean Dry Air)
• Min 19.5cfm wet pump (**PTFE vacuum fluid (like Fomblin) required)
  • NW25 (KF25) (1″) connection and also exhaust line (with > 5cfm draw)
  • Greater than 1 meter should use NW40 (1.5″) exhaust line
• Precursor’s attach via female VCR elbows (always use new gaskets)
  • Elbow: 1/4″ gasket first (with gloves on)
• For precursor attachment please refer to “AT810 Tool and Software Operation”.

Software

For detailed instructions see our presentation and video instructions: “AT810 Installation and Start-up“

• Human Machine Interface (HMI) PLC system with a 7” touch screen panel
• Advanced controls suitable for the deposition of standard ALD cycles as well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films
• Recipe database for high quality, tested processes
• Custom recipe input screen
• Real time display of process status
• Individually programmable heated source temperatures
• Built-in pulsing sequences for ternary compounds and nano-laminates
• Quick running with simple questions to get user going
  • Input subcycles and overall cycles