The AT610 is the most cost-effective 6″ thermal ALD tool on the market. 

Enhanced Performance for 6-Inch Substrates

The AT610 is optimized for 6-inch substrates or up to 210 x 210 mm square, offering improved thermal performance and enhanced precursor delivery systems. This system is ideal for applications requiring precise film deposition on larger wafers. Ask about our large batch system with up to 9 125 x 125mm substrates, double-sided deposition.

• Small Footprint Desktop System
• Semiconductor-grade metal sealed lines and high temperature compatible fast pulsing ALD valves.
• Ultrafast MFC for integrated inert gas purge.
• 6 inch circular chuck (up to 7″ square) customizable for smaller sizes or other shapes (11 mm tall).
• 3 organometallic precursors and 2 (up to 3) counter reactants.
• Heated lines throughout (from precursor to chamber).
• All aluminum (semiconductor grade) chamber ‒ range up to 310°C
• 7” touchscreen PLC controller (no PC required).

 Features

• Small Footprint Desktop System, cleanroom compatible.
• All aluminum (semiconductor grade) chamber ‒ range up to 310°C
• High temperature semiconductor grade fast pulsing ALD valves with ultrafast MFC for integrated inert gas purge.
• 6″ circular chuck (7″ square)customizable for smaller sizes or other shapes (11 mm tall).
• Streamlined chamber design and small chamber volume
• 3 organometallic precursors and 2 (up to 3) counter reactants.
  • Precursors can be heated to 150°C.
• Heated lines throughout (from precursor through to chamber).
• Simple system maintenance and lowest utilities and precursor usage on market
• High exposure (for trenches and porous substrates) and static processing mode
• 7″ touchscreen PLC controller (no PC required)

Specification

• Chamber temperatures from RT to 300°C ± 1°C
• Precursor temperatures from RT to 150°C ± 2°C (w/ heating jacket)
• Smallest footprint on market, bench top installation and cleanroom compatible
• Simple system maintenance and lowest utilities and precursor usage on market
• Streamlined chamber design and small chamber volume
• Fast cycling capability and high exposure, deep penetration processing available
• All metal sealed from precursor to chamber.
• Typical Operating Pressure
• Full HW and SW interlocks for safe operation in multi-user environment
• 110 – 220 VAC, single phase, 50/60Hz, 15 Amp (10A for 220V)
• Weight approximately 100lbs (45 kgs)

Options

• Customized chuck/platen (square, indents for smaller pieces, powders)
• Customized chamber (thicker substrates)
• ATOzone  – Ozone generator (required for some films: Pt, Ir, SiO₂, MoO₂, high quality Al₂O₃ below 60°C, high quality HfO₂)
  • Optional – Ozone Safety Monitor w real time detection of ambient ozone gas
• QCM (Quartz Crystal Microbalance)
• Glovebox integration (typically required to not expose substrate to moisture; Sulfides, etc..)
• External control – PC/software link (allows programing and running, remotely)
• Ventable Precursor cabinet
• Spare Chamber
• IGPA (inert gas pressure assist)for low vapor pressure precursors
• Higher temperatures on precursors (to 180°C)
• Third counter reactant
  • Software control of third counter reactant

Installation

• For detailed instructions see our presentation and video instructions: “AT410/610 Installation and Start-up“

• N₂ purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed), .
  • Input line is 1/4 female VCR compression fitting
  • Attach > 99.9995% nitrogen (UHP) purge gas via 1/4″ metal line to the 1/4″ compression fitting on back
• Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene  tubing or metal line to the other 1/4″ compression fitting marked CDA (Clean Dry Air)
• Min 12cfm wet pump (**PTFE vacuum fluid (like Fomblin) required) (610 and 810 use larger pumps typically 19.5 cfm or higher)
  • NW25 (KF25) (1″) connection and also exhaust line (with > 5cfm draw)
  • Greater than 1 meter should use NW40 (1.5″) exhaust line
• Precursor’s attach via female VCR elbows (always use new gaskets).
  • Elbow: 1/4″ gasket first (with gloves on)
• For precursor attachment please refer to AT410/AT610 Tool and Software Operation.

Software

For detailed instructions see our presentation and video instructions: “AT610 Installation and Start-up“

• Human Machine Interface (HMI) PLC system with a 7” touch screen panel
• Advanced controls suitable for the deposition of standard ALD cycles as well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films
• Recipe database for high quality, tested processes
• Custom recipe input screen
• Real time display of process status
• Individually programmable heated source temperatures
• Built-in pulsing sequences for ternary compounds and nano-laminates
• Quick running with simple questions to get user going
  • Input subcycles and overall cycles