- Tabletop design with small footprint integrate with modern instruments and benches
- -190°C - 1000°C depending on model
- Fits 10 mm - 300 mm wafers and devices
- Sealed chamber with gas purging capability
- 4 independent electrical probes with remote positioning
THERMAL FEATURES
|
Temperature Control |
mK2000 with programmable precision LVDC PID method to minimize electrical noise |
|
Thermal Block |
Aluminum, Silver, or Ceramic options for superior thermal uniformity |
|
Temperature Resolution |
0.01°C (RTD) or 0.1°C (Themocouple ) |
|
Temperature Stability |
±0.05°C (above 25°C), ±0.1°C (below 25°C) |
|
Power Supply |
Universal power input |
|
Software |
Windows software to record and export temperature-time data |
ELECTRICAL FEATURES
|
Electrical Probes |
Standard tungsten-rhenium DC probes with other probe options available |
|
Probe Positioning |
XYZ micropositioners remotely manipulate probes within sealed sample chambers with 20 mm fine travel |
|
Connectors |
Coaxial, floating, or triaxial BNC connectors |
|
Sample Surface |
Grounded, floating, or triaxial options |
OPTICAL FEATURES
|
Optical Access |
Reflection capability via large window |
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Optical Windows |
Removable and exchangeable windows permit full-spectrum transparency |
|
Minimum Objective Working Distance |
25 mm |
|
Top Window |
50 mm diameter |
|
Top Viewing Angle |
±40° from normal |
|
Window Defrost |
Integrated external window defrost |
STRUCTURAL FEATURES
|
Sample Area |
Fits 10 mm-50x50mm for standard station, up to 300 mm for custom |
|
sample Height |
6 mm |
|
Probe Positioning |
XYZ micropositioners remotely manipulate probes within sealed sample chambers with 20 mm fine travel |
|
Atmosphere Control |
Gas purging to control humidity, condensation, and oxidation |
|
Frame Cooling |
Integrated frame cooling via hose barb ports with optional chiller system |
|
Frame Dimensions |
1060 mm x 600 mm x 213.2 mm |
|
Weight |
20 kg, aluminum or stainless steel options |
MODELS
• TP102SG-PS Series operates from -40°C to 180°C with thermoelectric cooling and heating and gas purging
• HCP622G-PS Series operates from -190°C (with liquid N2 cooling) to 600°C (with resistive heating) with gas purging
• HP1000G-PS Series operates from 35°C to 1000°C with resistive heating only, and supports both gas purging
• CUSTOM Series available to achieve lower and higher temperatures and custom features for any application, wafer size upto 300mm
APPLICATIONS
• Characterize electrical behavior of thin films, 2D materials, nanomaterials, and molecular/organic electronic devices
• Electrically grounded, floating, or triaxial options for the thermal block surfaces and triaxial BNC connectors
• DC electrical probe options in tungsten-rhenium, beryllium-copper, or other materials
• Remotely manipulate probes in sealed chambers with XYZ positioning
• Test components of wafers, semiconductor devices, integrated circuits, printed circuit boards, photovoltaics, LC’s, and LED’s
• Measure IV and CV characteristics, breakdown voltage, leakage current, resistance, dielectric strength, and diode efficiency
