TEC BASED SQUARE WAFER CHUCKS

Thermal Properties Analyzer

Thermal conductivity (Lambda), Ash fusion, Thermal screening

Microscopic Hot/Cold Stage, Wafer chuck, Thermal plate, Thermal probe station

Home > Products > 열물성분석기 (열전도도, 회융점, Tm, Hot/cold stage)

Wafer Chuck

Surface Options	Standard: clear anodized aluminum Optional: nickel, zinc, or gold plating
Wafer Vacuum Control	Independent vacuum channels Custom vacuum holes available
Base Cooling	Integrated base cooling via hose barb ports with optional chiller system
Mounting	Probe station mounting capability Custom adapter options
Surface Electrical Options	grounded (S), floating (SF), or triaxial (ST) surfaces
BNC Connector Options	Coaxial, floating, or triaxial BNC
Temperature Control	mK2000 with programmable precision switching PID method Optional LVDC PID method to minimize electrical noise
Temperature Sensor	100 Ω Platinum RTD
Temperature Resolution	0.01°C
Temperature Stability	±0.05°C
Power Supply	Universal power input
Software	Windows software to record and export temperature-time data

Instec, Inc. USA

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