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Round thermal wafer chucks
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Designed for wafer handling
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Modern electrical probing and testing
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Multi vacuum zones for different wafer sizes
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Optional cooling down to -100°C
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Optional triaxial for pA current measurements
FEATURES
|
Surface Options |
|
|---|---|
|
Wafer Vacuum Control |
|
|
Lift Pin |
Optional |
|
Base Cooling |
Integrated base cooling via hose barb ports with optional chiller system |
|
Mounting |
|
|
Surface Electrical Options |
grounded (R), floating (RF), or triaxial (RT) surfaces |
|
BNC Connector Options |
Coaxial, floating, or triaxial BNC |
|
Temperature Control |
|
|
Temperature Sensor |
100 Ω Platinum RTD |
|
Temperature Resolution |
0.01°C |
|
Temperature Stability |
±0.05°C (above 25°C) and ±0.1°C (below 25°C) |
|
Power Supply |
115 V or 230 V depending on region |
|
Software |
Windows software to record and export temperature-time data |
MODELS
|
Model |
Dimensions |
Fits Samples |
Weight |
Temperature Range |
Maximum Rate |
|||
|---|---|---|---|---|---|---|---|---|
|
|
|
MIN |
MAX |
|
MIN |
MAX |
Heating |
Cooling |
|
HCC206R/RF |
200 mm x 176 mm x 32.62 mm |
45mm |
150mm |
2.0 kg |
-100°C |
200°C |
+30°C/min |
-15°C/min |
|
HCC206RT |
200 mm x 176 mm x 32.62 mm |
45mm |
150mm |
2.5 kg |
-80°C |
200°C |
+15°C/min |
-8°C/min |
|
HCC306R/RF |
200 mm x 176 mm x32.62 mm |
45mm |
150mm |
2.0 kg |
-100°C |
300°C |
+30°C/min |
-15°C/min |
|
HCC208R/RF |
250 mm x 200 mm x 32.5 mm |
100mm |
200mm |
3.5 kg |
-80°C |
200°C |
+50°C/min |
-5°C/min |
|
HCC208RT |
250 mm x 200 mm x 32.5 mm |
100mm |
200mm |
4.0 kg |
-80°C |
200°C |
+15°C/min |
-3.5°C/min |
|
HCC308R/RF |
250 mm x 200 mm x 32.5 mm |
100mm |
200mm |
3.5 kg |
-80°C |
300°C |
+50°C/min |
-5°C/min |
|
HCC20CR/RF |
365 mm x 325 mm x 40 mm |
100mm |
300mm |
8.0 kg |
-80°C |
200°C |
+15°C/min |
-1.5°C/min |
|
HCC20CRT |
365 mm x 325 mm x 40 mm |
100mm |
300mm |
10.0 kg |
-80°C |
200°C |
+12°C/min |
-1.2°C/min |
|
HCC30CR/RF |
365 mm x 325 mm x 40 mm |
100mm |
300mm |
8.0 kg |
-80°C |
300°C |
+15°C/min |
-1.5°C/min |
