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MBE, Molecular Beam Epitaxy System

Dr. Eberl MBE-Komponenten GmbH, Germany

Doping Cells

Doping Cells

 

DEZ 

Doping Effusion Cells

DEZ 40-5-27 Doping Effusion Cell on DN40CF (O.D.2.75") flange, with conical 5 cm³ PBN crucible

 
  • Compatible with all MBE systems
  • Conical shaped crucibles with crucible capacities 2, 5, and 12 cm³
  • Most effective Ta-wire heating system
  • Large flux distribution providing excellent homogeneities
  • High reliability and long lifetime
  • Optional: on cell flange integrated shutter

DDS 

Dual Doping Source

DDS 63-2x2-16-2S Dual Doping Source for Si and Be on one DN63 CF flange, with two 2 cm3 crucibles, individual cell shutters and water cooling shield between the cells

 
  • Cluster sources increase the capacity of UHV systems
  • Customized designs with all kind of effusion cells
  • Compact and intelligent cell design
  • Various crucibles available
  • Solutions with integrated cooling shrouds and shutters

Data Sheet

DECO-D

Phosphorus Doping Source

DECO-D 40-10-22-KS Phosphorus doping source, on a flange DN40 CF (O.D. 2.75"), with 10 cm³ PBN crucible and Ga-trapping PBN cap

 
  • 1020/cm3 n-type doping in Si/SiGe MBE
  • P-doping through GaP decomposition
  • High P incorporation rate
  • Minimum memory effects
  • Easy to install and to operate
  • Sharp doping profiles
  • Precise and fast flux control

SUSI-D

Silicon Sublimation Doping Source

SUSI-D 63 Silicon Sublimation Doping Source on DN63CF (O.D. 4.5") flange

 
  • Thermal sublimation of silicon from high purity intrinsic or highly doped Si filament
  • Excellent growth of thin silicon layers
  • Compatible with most MBE systems
  • Water-cooled electrical contacts
  • Inner filament shielding with pure silicon parts
  • No ceramic parts in the hot zone

SUKO-D

Carbon Doping Source

SUKO 40 Carbon Sublimation Source on DN40CF (O.D. 2.75") flange

 
  • High-mobility GaAs p-type doping
  • Fast and precise flux control
  • Ultra-high purity pyrolytic graphite (PG) filament
  • Water-cooled electrical contacts
  • Inner filament shielding with pure pyrolytic graphite parts
  • No ceramic or metal parts in the hot zone

EBVV-B

Electron Beam Boron Doping Source EBVV-B

<EBVV-B 63-4 Electron Beam Boron Doping Source on DN63CF (O.D. 4.5") flange with 4 cm³ crucible capacity

 
  • Up to 1021/ccm Boron doping in Si-MBE
  • Evaporation of elemental Boron or Si-B alloy in vertical e-beam evaporator
  • Small dimensions; can be used in DN63CF
  • (O.D. 4.5“) effusion cell ports; hearth volume 5 cm³
  • Long filament lifetime and easy maintenance
  • 270° beam deflection
  • High frequency x-y-beam deflection system
  • Silicon shielding parts for use in SiGe-MBE

Data Sheet

 

Select doping cell by dopant material:

Bulkmaterial

Dopant

Type

Source

Comment

GaAs / AlGaAs

Si

n

DEZ

 

 

Si

n

SUSI-D

high mobility doping, fast switching

 

Te

n

DEZ

GaTe source material, T=700°C -> 1019cm-3

 

Be

p

DEZ

 

 

C

p

SUKO-D

high mobility p-type doping

Si / SiGe

Sb

n

DEZ

segregation effect

 

As

n

DEZ

high segregation effect in MBE

 

P

n

DECO-D

GaP source material, T=700°C -> 1019cm-3

 

B

p

HTS

 

 

B

p

EBVV-B

extremely high Boron doping levels

 

Ga

p

DEZ

 

 

Al

p

DEZ

segregates in MBE

 

Er

opt.

DEZ

used for light emission

GaN / GaInN

Si

n

DEZ

 

 

Si

n

SUSI

long filament lifetime / Si flux option

 

Mg

p

DEZ

 

 

Zn

p

DEZ

high activation energy

GaP / GaAsP

S

n

OME, valved source

please contact us

 

Te

n

DEZ

use GaTe as source material

 

Zn

p

DEZ

 

SiC

N

n

plasma source

please contact us

 

Al

p

DEZ

 

ZnO

B

n

HTS

 

 

N

p

plasma source

please contact us

ZnSe

I

n

valved source

valved source / please contact us

 

ZnCl2

n

gas injector

valved source / please contact us

 

N

p

plasma source

please contact us

CdTe

Al

n

DEZ

 

 

Cu

p

DEZ

 

 

Sb

p

DEZ

 

Other

Fe

 

HTEZ

 

 

Cr

 

HTEZ

 

 

Cu

 

DEZ

 

 

 

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