Linear UHV e-beam source, in-situ 틸트, 3 인치 UHV 스퍼터 소스, 다양한 기판 캐리어 및 진공 로드 락 (vacuum load lock)을 갖춘 강력한 모델입니다.
850°C 램프 히터에서 기판 캐리어(substrate carrier)를 수용할 수있는 틸팅 수냉식 ring.
링은 두 source의 정상적인 증착 (normal deposition) 또는 shadow evaporation을 위해 배향될 수 있습니다.
a substrate carrier from and 850°C lamp heater.
The ring can be oriented for normal deposition from both sources or
for shadow evaporation.
by a 2" 1000°C, tilting, substrate heater with a programmable,
water cooled wedge shutter for gradient film deposition.
General Information
AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum.
These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.
Multi-Techniques employed include:
- Magnetron Sputtering
- E-Beam Evaporation
- Thermal Evaporation
- Ion Milling
- Ion Beam Deposition
- Pulsed Laser Deposition
- Ellipsometry
- Rapid Thermal Anneal
- Oxygenation and Nitridization
- XPS/AUGER/LEED Analysis
- MBE, RHEED, MOS, SIMS, RIBE
This powerful tool features a linear UHV e-beam source, a 3" UHV sputter source with in-situ tilt, several different substrate carriers and a vacuum load lock.
