6 pocket UHV e-beam 소스와 azimuthal rotation 및 RF bias가 있는 ±200° 틸팅 기판 홀더, 2 UHV 스퍼터 소스 및 4cm 격자 형 이온 소스 , AJA사의 고유한 "magnetic bayonet" 이송 시스템
+/- 200° tilting substrate holder with azimuthal rotation and
RF bias, (2) UHV sputter sources and a 4cm, gridded ion source.
General Information
AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum.
These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.
Multi-Techniques employed include:
- Magnetron Sputtering
- E-Beam Evaporation
- Thermal Evaporation
- Ion Milling
- Ion Beam Deposition
- Pulsed Laser Deposition
- Ellipsometry
- Rapid Thermal Anneal
- Oxygenation and Nitridization
- XPS/AUGER/LEED Analysis
- MBE, RHEED, MOS, SIMS, RIBE
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