-
Square sample area to accommodate various sample sizes and shapes
-
Better integrate into some experimental workspaces
-
S (grounded), SF (floating), or ST (triaxial) options
-
Multi vacuum zones for different wafer sizes
-
Optional cooling down to -120°C
-
Optional triaxial for pA current measurements
FEATURES
|
Surface Options |
|
|---|---|
|
Wafer Vacuum Control |
|
|
Lift Pin |
Optional |
|
Base Cooling |
Integrated base cooling via hose barb ports with optional chiller system |
|
Mounting |
|
|
Surface Electrical Options |
Grounded (S), Floating (SF), or Triaxial (ST) surfaces |
|
BNC Connector Options |
Coaxial, floating, or triaxial BNC |
|
Temperature Control |
|
|
Temperature Sensor |
100 Ω Platinum RTD |
|
Temperature Resolution |
0.01°C |
|
Temperature Stability |
±0.05°C (above 25°C) and ±0.1°C (below 25°C) |
|
Temperature Uniformity |
±2% or better |
|
Power Supply |
115 V or 230 V depending on region |
|
Software |
Windows software to record and export temperature-time data |
MODELS
|
Model |
Size |
Fits Samples |
Weight |
Temperature Range |
Maximum Rate at 100°C |
|||
|---|---|---|---|---|---|---|---|---|
|
|
|
MIN |
MAX |
|
MIN |
MAX |
Heating |
Cooling |
|
HCC602 |
|
|
|
|
-120°C |
600°C |
|
|
|
HCC 212/312S |
50 mm |
8mm |
50mm |
0.4 kg |
-120°C |
200/300°C |
+100°C / min |
-10°C / min |
|
HCC 214/314S |
100 mm |
15mm |
100mm |
1.2 kg |
-120°C |
200/300°C |
+50°C / min |
-20°C / min |
|
HCC 216/316S |
150 mm |
40mm |
150mm |
3.0 kg |
-100°C |
200/300°C |
+30°C / min |
-12°C / min |
|
HCC 218/318S |
200 mm |
40mm |
200mm |
5.0 kg |
-80°C |
200/300°C |
+30°C / min |
-5°C / min |
