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Thermal Properties Analyzer

Thermal Conductivity (Lambda), Ash Fusion, Thermal Screening, Microscopic Hot/Cold Stage, Wafer Chuck, Thermal Plate, Thermal Probe Station

HCC SQUARE WAFER CHUCKS


  • Square sample area to accommodate various sample sizes and shapes
  • Better integrate into some experimental workspaces
  • S (grounded), SF (floating), or ST (triaxial) options
  • Multi vacuum zones for different wafer sizes
  • Optional cooling down to -120°C
  • Optional triaxial for pA current measurements

 

FEATURES

Surface Options

  • Standard: clear anodized aluminum
  • Optional: nickel, zinc, or gold plating

Wafer Vacuum Control

  • Independent vacuum channels
  • Custom vacuum holes available

Lift Pin

Optional

Base Cooling

Integrated base cooling via hose barb ports with optional chiller system

Mounting

  • Probe station mounting capability
  • Custom adapter options

Surface Electrical Options

Grounded (S), Floating (SF), or Triaxial (ST) surfaces

BNC Connector Options

Coaxial, floating, or triaxial BNC

Temperature Control

  • mK2000 with programmable precision switching PID method
  • Optional LVDC PID method to minimize electrical noise

Temperature Sensor

100 Ω Platinum RTD

Temperature Resolution

0.01°C

Temperature Stability

±0.05°C (above 25°C) and ±0.1°C (below 25°C)

Temperature Uniformity

±2% or better

Power Supply

115 V or 230 V depending on region

Software

Windows software to record and export temperature-time data

 

MODELS

Model

Size

Fits Samples

Weight

Temperature Range

Maximum Rate at 100°C

 

 

MIN

MAX

 

MIN

MAX

Heating

Cooling

HCC602

 

 

 

 

-120°C

600°C

 

 

HCC 212/312S

50 mm

8mm

50mm

0.4 kg

-120°C

200/300°C

+100°C / min

-10°C / min

HCC 214/314S

100 mm

15mm

100mm

1.2 kg

-120°C

200/300°C

+50°C / min

-20°C / min

HCC 216/316S

150 mm

40mm

150mm

3.0 kg

-100°C

200/300°C

+30°C / min

-12°C / min

HCC 218/318S

200 mm

40mm

200mm

5.0 kg

-80°C

200/300°C

+30°C / min

-5°C / min

 


 

Instec, Inc. USA
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