ATC Dual Chamber - Sputtering / Pulsed Laser Deposition (PLD)
오른쪽 챔버는 풀 버전의 ATC 2200으로써, in-situ tilt가 있는 6 UHV sputter source와 RF 바이어스, Z 모션 및 azimuthal rotation을 지원하는 850°C 기판 히터를 갖추고 있습니다. 왼쪽의 챔버는 safety tunnel을 통한 레이저로 백업되며 6개의 target turret에서 나온 PLD (Pulsed Laser Deposition)가 특징입니다. 이 챔버에는 850°C 가열 및 고압 이중 시차 펌핑 RHEED (double differentially pumped RHEED)도 포함됩니다. 두 챔버는 common vertex 로드 락으로 연결됩니다.
During laser operation individual targets rotate azimuthally
and execute an accel/decel wobble motion to allow uniform target erosion.
General Information
AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum.
These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.
Multi-Techniques employed include:
- Magnetron Sputtering
- E-Beam Evaporation
- Thermal Evaporation
- Ion Milling
- Ion Beam Deposition
- Pulsed Laser Deposition
- Ellipsometry
- Rapid Thermal Anneal
- Oxygenation and Nitridization
- XPS/AUGER/LEED Analysis
- MBE, RHEED, MOS, SIMS, RIBE
The chamber on the right is a full featured ATC 2200 with (6) UHV sputter sources with in-situ tilt and an 850°C substrate heater with RF bias, Z motion and azimuthal rotation. The chamber on the left backs up to a laser via the safety tunnel and features PLD from a six target turret. This chamber also includes 850°C heating and high pressure, double differentially pumped RHEED. Both are connected by a common vertex load-lock.
| 카테고리 | 제목 | 작성자 | 추천수 | 조회수 | 작성 | |
|---|---|---|---|---|---|---|
| 이온밀링시스템 | ATC-2020-IM 이온밀링시스템 (ION MILLING SYSTEM) file | YEONJIN | 0 | 1560 | 2020-12-14 | ATC-2020-IM 이온밀링시스템 (ION MILLING SYSTEM) file |
| 이온밀링시스템 | ATC-2036-IM 이온밀링시스템 (ION MILLING SYSTEM) file | YEONJIN | 0 | 1495 | 2020-12-14 | ATC-2036-IM 이온밀링시스템 (ION MILLING SYSTEM) file |
| 이온밀링시스템 | ATC-1800-IM-R 이온밀링시스템 (ION MILLING SYSTEM) file | YEONJIN | 0 | 1373 | 2020-12-14 | ATC-1800-IM-R 이온밀링시스템 (ION MILLING SYSTEM) file |
| Multi-Technique System | ATC UHV Dual Chambers file | YEONJIN | 0 | 1287 | 2020-12-14 | ATC UHV Dual Chambers file |
| Multi-Technique System | ATC Dual Chamber with Common Cassette Load-lock file | YEONJIN | 0 | 1368 | 2020-12-14 | ATC Dual Chamber with Common Cassette Load-lock file |
| Multi-Technique System | ATC Dual Chamber - Sputtering / Pulsed Laser Deposition (PLD) file | YEONJIN | 0 | 1412 | 2020-12-14 | ATC Dual Chamber - Sputtering / Pulsed Laser Deposition (PLD) file |
| Multi-Technique System | Dual ATC-Orion UHV with Common Load-Lock file | YEONJIN | 0 | 1150 | 2020-12-14 | Dual ATC-Orion UHV with Common Load-Lock file |