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Thin Film Deposition System

Modular PVD System - The HEX Series (Korvus Technology, UK)

Home > Products > 진공증착장비 (Vacuum Deposition System) > Thin Film Deposition System > 박막증착시스템 (Korvus Technology - Thin Film Deposition System)
증착장비 부속품

TAU UHV

THE HEX SERIES

4 Pocket Mini E Beam Evaporator

 

 
  • 4 Pocket Mini Electron-Beam Source
  • Sequential or Co-Evaporation
  • Flux Monitoring Electrodes
  • Water-Cooled
  • From CF63 Mounting Flange
  • 250C Bakeout Temperature
  • Up to 800mm Length

 

 

The TAU UHV is a UHV-compatible four-pocket electron-beam evaporation source for thin-film deposition. The TAU UHV is the UHV version of our proprietary source.

Configurable to different flange sizes and angles, the TAU UHV can be fitted to any existing deposition system.

A compact and powerful tool for evaporating metals, the TAU UHV can evaporate up to four pockets simultaneously or sequentially. Each pocket can be equipped with crucibles or rods.

 

 

 

 


 

 

 


 

 

 


 

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