-
Thermoelectric cooling and heating
-
Square shape accommodates various sample sizes and shapes
-
Cooling down to -30°C without using LN2
-
Multi vacuum zones for different wafer sizes
-
Optional triaxial for pA current measurements
FEATURES
Surface Options |
|
---|---|
Wafer Vacuum Control |
|
Base Cooling |
Integrated base cooling via hose barb ports with optional chiller system |
Mounting |
|
Surface Electrical Options |
grounded (S), floating (SF), or triaxial (ST) surfaces |
BNC Connector Options |
Coaxial, floating, or triaxial BNC |
Temperature Control |
mK2000 with programmable precision switching PID method Optional LVDC PID method to minimize electrical noise |
Temperature Sensor |
100 Ω Platinum RTD |
Temperature Resolution |
0.01°C |
Temperature Stability |
±0.05°C |
Power Supply |
Universal power input |
Software |
Windows software to record and export temperature-time data |
MODELS
Model |
SIZE, mm |
Fits Samples |
Weight |
Temperature Range |
Maximum Rate at 100°C |
|||
---|---|---|---|---|---|---|---|---|
MIN |
MAX |
MIN |
MAX |
Heating |
Cooling |
|||
TC102S |
81 X 56 X 22 |
12mm |
50mm |
0.4 kg |
-30°C |
120°C |
+40°C / min |
-15°C / min |
TC104S |
132 x 110 x 28 |
12mm |
100mm |
1.0 kg |
-30°C |
120°C |
+20°C / min |
-10°C / min |
TC106S |
200 x 160 x 30 |
40mm |
150mm |
3.0 kg |
-30°C |
120°C |
+15°C / min |
-6°C / min |
TC108S |
250 x 210 x 35 |
40mm |
200mm |
10 kg |
-30°C |
120°C |
+12°C / min |
-4°C / min |
TC10CS |
355 x 315 x 40 |
100mm |
300mm |
25 kg |
-30°C |
120°C |
+7°C / min |
-4°C / min |