Tellurium Dioxide Sputtering

Target Description

Tellurium Dioxide Sputtering Target is a material used in the sputtering process for depositing thin films onto substrates. Tellurium dioxide is a compound composed of tellurium (Te) and oxygen (O) ions. In sputtering, high-energy ions are directed at the tellurium dioxide sputtering target, causing atoms or molecules to be ejected from the target surface. These ejected particles then deposit onto a substrate, forming a thin film with properties inherited from the tellurium dioxide material.

Tellurium Dioxide Sputtering Target Specifications

Tellurium Dioxide Sputtering Target Handling Notes

1. Indium bonding is recommended for Tellurium Dioxide Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
2. This material has a low thermal conductivity and is susceptible to thermal shock.

Tellurium Dioxide Sputtering Target Application

• Optical Coatings: Tellurium dioxide thin films can be used in optical coatings for applications such as anti-reflective coatings, beam splitters, and other optical devices.
• Semiconductor Manufacturing: Tellurium dioxide coatings may find applications in the semiconductor industry, particularly in the fabrication of certain electronic and optoelectronic devices.
• Photovoltaics: Tellurium is used in the production of thin-film solar cells, and tellurium dioxide may be employed in the manufacturing process.
• Research and Development: Tellurium dioxide thin films may be used in research and development for specific applications where the unique properties of tellurium dioxide are desirable.

Tellurium Dioxide Sputtering Target Packaging

Our Tellurium Dioxide Sputtering Target is widely used in the production of coatings for various purposes, such as improving the wear resistance of tools, enhancing the durability of surfaces, or providing specific optical or electrical properties.