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Sputtering Targets

Different Shapes of Sputtering Targets

(주)연진에스텍은 Planar (Flat) TargetRotary (Cylindrical) Target, Circular (Disc)TargetRing Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 특이한 요청 시 타겟 크기의 커스터마이즈가 가능합니다.

 

Key Features

  • High Purity & Performance: 일관된 증착 품질과 오염을 줄이도록 가공합니다.
  • Material Variety: 다양한 응용 분야의 요구 사항에 맞게 순수 금속, 합금, 세라믹 및 화합물로 제공됩니다.
  • Custom Manufacturing: 특정 시스템의 필요요구 사항에 맞게 크기와 형태, 조성을 맞춤화했습니다.
  • Precision Design: 반복 가능하고 균일한 박막 결과를 위해 엄격한 공차로 제조되었습니다.
  • Flexible Supply Chain: 최고의 제조업체와 강력한 파트너십을 통해 일관된 품질과 on-time 납품을 보장합니다.

 


OXIDE TARGET

Bismuth Vanadate Sputtering Targets, BiVO4


 

Bismuth Vanadate Sputtering

Targets Description

 

Bismuth Vanadate Sputtering Target is a specialized material used in a technique called sputter deposition. This process is a common method for depositing thin films of material onto a substrate in a controlled and precise manner.

Bismuth vanadate is a compound made up of bismuth (Bi), vanadium (V), and oxygen (O). It is known for its interesting optical and electronic properties, making it suitable for applications in areas such as solar energy conversion and photocatalysis.

 

Bismuth Vanadate Sputtering Targets Specifications

Compound Formula

BiVO4

Molecular Weight

323.92

Appearance

Yellowish solid

Melting Point

N/A

Density

6.1 g/cm3

Available Sizes

Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

 

Thick: 0.125″, 0.250″

 

Bismuth Vanadate Sputtering Targets Application

Bismuth Vanadate Sputtering Target is suitable for applications in areas such as solar energy conversion and photocatalysis.

 

Bismuth Vanadate Sputtering Targets Packaging

Our Bismuth Vanadate Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.

 

 

 

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