Copper(I) Oxide Sputtering
Targets Description
Copper(I) Oxide Sputtering Target is a specialized material used in sputter deposition. Sputter deposition is a technique for depositing thin films of material onto a substrate in a controlled and precise manner. This process is widely used in manufacturing electronic devices, solar cells, and various other applications.
In the sputtering process, the Copper(I) Oxide Sputtering Target is bombarded with high-energy ions, causing atoms or molecules to be ejected from the target material. These ejected particles then deposit onto a substrate, forming a thin film. The resulting thin film of cobalt oxide may exhibit unique electrical, magnetic, or catalytic properties, depending on the specific application and the desired characteristics of the thin film.
Copper(I) Oxide Sputtering Targets Specifications
|
Compound Formula |
Cu2O |
|
Molecular Weight |
143.09 |
|
Appearance |
brownish-red solid |
|
Melting Point (℃) |
1235 |
|
Boiling Point (℃) |
1800 |
|
Density (g/cm3) |
6.0 |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Copper(I) Oxide Sputtering Targets Application
Copper(I) Oxide Sputtering Target suits applications such as electrochromic devices, batteries, and catalysts. The use of a Copper(I) Oxide Sputtering Target allows for precise control over the composition and thickness of the deposited thin film, making it a versatile tool in materials science and device manufacturing.
Copper(I) Oxide Sputtering Targets Packaging
Our Copper(I) Oxide Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.