Cobalt Oxide Sputtering Targets Description
Cobalt Oxide Sputtering Target is a specialized material used in sputter deposition. Sputter deposition is a technique for depositing thin films of material onto a substrate in a controlled and precise manner. This process is widely used in manufacturing electronic devices, solar cells, and various other applications.
In the sputtering process, the Cobalt Oxide Sputtering Target is bombarded with high-energy ions, causing atoms or molecules to be ejected from the target material. These ejected particles then deposit onto a substrate, forming a thin film. The resulting thin film of cobalt oxide may exhibit unique electrical, magnetic, or catalytic properties, depending on the specific application and the desired characteristics of the thin film.
Cobalt Oxide Sputtering Targets Specifications
|
Compound Formula |
Co3O4 |
|
Molecular Weight |
240.80 |
|
Appearance |
black solid |
|
Melting Point (℃) |
895 |
|
Boiling Point (℃) |
900 |
|
Density (g/cm3) |
6.11 |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Cobalt Oxide Sputtering Targets Application
Cobalt Oxide Sputtering Target is suitable for applications such as electrochromic devices, batteries, and catalysts. The use of a Cobalt Oxide Sputtering Target allows for precise control over the composition and thickness of the deposited thin film, making it a versatile tool in materials science and device manufacturing.
Cobalt Oxide Sputtering Targets Packaging
Our Cobalt Oxide Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.