Praseodymium Fluoride Sputtering Target Description Praseodymium Fluoride Sputtering Target is used in sputter deposition processes to create thin films containing praseodymium fluoride. Praseodymium is often used in the production of magnets, lasers, and other technologies. A sputtering target is a material used in a process called sputter deposition, which is a technique commonly employed in the manufacturing of thin films. Thin films find applications in various industries, including electronics, optics, and coatings. Sputtering is a physical vapor deposition (PVD) method where high-energy ions are used to dislodge atoms from a target material, and these atoms then deposit onto a substrate, forming a thin film. Praseodymium Fluoride Sputtering Target Specifications Compound Formula PrF3 Molecular Weight 197.9 Appearance Green target Melting Point (℃) 1395 Density (g/cm3) 6.3 Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ Praseodymium Fluoride Sputtering Target Handling Notes Indium bonding is recommended for Praseodymium Fluoride Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc. This material has a low thermal conductivity and is susceptible to thermal shock. Praseodymium Fluoride Sputtering Target Application Praseodymium Fluoride Sputtering Target is used in sputter deposition processes to create thin films containing praseodymium fluoride. The use of praseodymium fluoride in thin films may have applications in optical coatings, sensors, and other electronic devices Praseodymium Fluoride Sputtering Target Packaging Our Praseodymium Fluoride Sputtering Target is widely used in the production of coatings for various purposes, such as improving the wear resistance of tools, enhancing the durability of surfaces, or providing specific optical or electrical properties.

Cryolite Sputtering Target Description Cryolite Sputtering Target is a material used in the sputtering process for depositing thin films onto substrates. Cryolite is a mineral compound consisting of sodium (Na), aluminum (Al), and fluorine (F) ions. In sputtering, high-energy ions are directed at the cryolite sputtering target, causing atoms or molecules to be ejected from the target surface. These ejected particles then deposit onto a substrate, forming a thin film with properties inherited from the cryolite material. Cryolite Sputtering Target Specifications Compound Formula Na3·AlF6 Molecular Weight 209.94 Appearance Gray target Melting Point (℃) 950-1012 Density (g/cm3) 2.9-3.0 Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ Cryolite Sputtering Target Handling Notes Indium bonding is recommended for Cryolite Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc. This material has a low thermal conductivity and is susceptible to thermal shock. Cryolite Sputtering Target Application Optical Coatings: Cryolite thin films can be used in optical coatings for various applications, such as anti-reflective coatings and interference filters. Semiconductor Manufacturing: Cryolite coatings may find applications in the semiconductor industry, particularly in the fabrication of electronic and optoelectronic devices. Research and Development: Cryolite thin films may be used in research and development for specific applications where the properties of cryolite are desirable. Cryolite Sputtering Target Packaging Our Cryolite Sputtering Target is widely used in the production of coatings for various purposes, such as improving the wear resistance of tools, enhancing the durability of surfaces, or providing specific optical or electrical properties.

Neodymium Fluoride Sputtering Target Description Neodymium Fluoride Sputtering Target is a material used in the process of sputtering for depositing thin films onto a substrate. Neodymium fluoride is a compound composed of neodymium (Nd) and fluorine (F) ions. In the sputtering process, high-energy ions bombard the surface of the neodymium fluoride sputtering target, causing atoms or molecules to be ejected. These ejected particles then deposit onto a substrate, forming a thin film with properties inherited from the target material. Sputtering targets come in different shapes and sizes based on the requirements of the thin film deposition process and the sputtering equipment used. The choice of a neodymium fluoride sputtering target depends on the desired properties of the thin film and its intended applications, which may include optics, electronics, or other advanced materials. Neodymium Fluoride Sputtering Target Specifications Compound Formula NdF3 Molecular Weight 201.24 Appearance Gray target Melting Point (℃) 1,374 Density (g/cm3) 6.5 Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ Neodymium Fluoride Sputtering Target Handling Notes Indium bonding is recommended for Neodymium Fluoride Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc. This material has a low thermal conductivity, and is susceptible to thermal shock. Neodymium Fluoride Sputtering Target Application Optical Coatings: Neodymium Fluoride thin films are used in optics for anti-reflective coatings and interference filters. Semiconductor Manufacturing: the fabrication of certain electronic and optoelectronic devices. Research and Development: Neodymium fluoride thin films may be used in various research and development applications Neodymium Fluoride Sputtering Target Packaging Our Neodymium Fluoride Sputtering Target is widely used in the production of coatings for various purposes, such as improving the wear resistance of tools, enhancing the durability of surfaces, or providing specific optical or electrical properties.

Description of Lead Fluoride Sputtering Target Lead, also called plumbum, is a chemical element originated from the Anglo-Saxon lead (plumbum in Latin). It was early used in 7000 BC and discovered by people from the Near East. “Pb” is the canonical chemical symbol of lead. Its atomic number in the periodic table of elements is 82 with location at Period 6 and Group 14, belonging to the p-block. The relative atomic mass of lead is 207.2(1) Dalton, the number in the brackets indicating the uncertainty. Specifications of Lead Fluoride Sputtering Target Material Type Lead Fluoride Symbol PbF2 Color/Appearance White solid Melting Point 824° C Density 8.445 g/cm3 Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information. Packing Our lead fluoride sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Zinc Fluoride Sputtering Target Description Zinc fluoride sputtering target is a type of fluoride ceramic sputtering target composed of zinc and fluorine. Zinc is a chemical element originated from the German, ‘zinc’, which may in turn be derived from the Persian word ‘sing’, meaning stone. It was early used before 1000 BC and discovered by Indian metallurgists. “Zn” is the canonical chemical symbol of zinc. Its atomic number in the periodic table of elements is 30 with location at Period 4 and Group 12, belonging to the d-block. The relative atomic mass of zinc is 65.409(4) Dalton, the number in the brackets indicating the uncertainty. Fluorine, also called fluorin, is a chemical element originated from the Latin ‘fluere’, meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère. The isolation was later accomplished and announced by H. Moissan. “F” is the canonical chemical symbol of fluorine. Its atomic number in the periodic table of elements is 9 with location at Period 2 and Group 17, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, the number in the brackets indicating the uncertainty. Zinc Fluoride Sputtering Target Application The zinc fluoride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc. Zinc Fluoride Sputtering Target Packing Our zinc fluoride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Titanium Fluoride Sputtering Target Titanium fluoride sputtering target is a type of fluoride ceramic sputtering target composed of titanium and fluorine. Titanium is a chemical element originated from Titans, the sons of the Earth goddess of Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. “Ti” is the canonical chemical symbol of titanium. Its atomic number in the periodic table of elements is 22 with location at Period 4 and Group 4, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, the number in the brackets indicating the uncertainty. Fluorine, also called fluorin, is a chemical element originated from the Latin ‘fluere’, meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère. The isolation was later accomplished and announced by H. Moissan. “F” is the canonical chemical symbol of fluorine. Its atomic number in the periodic table of elements is 9 with location at Period 2 and Group 17, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, the number in the brackets indicating the uncertainty. Titanium Fluoride Sputtering Target Application The titanium fluoride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc. Titanium Fluoride Sputtering Target Packing Our titanium fluoride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Tin Fluoride Sputtering Target Tin fluoride sputtering target is a type of fluoride ceramic sputtering target composed of tin and fluorine. Tin, also called stannum, is a chemical element originated from the Anglo-Saxon word tin (stannum in Latin, meaning hard). It was early used in 3500 BC. “Sn” is the canonical chemical symbol of tin. Its atomic number in the periodic table of elements is 50 with location at Period 5 and Group 14, belonging to the p-block. The relative atomic mass of tin is 118.710(7) Dalton, the number in the brackets indicating the uncertainty. Fluorine, also called fluorin, is a chemical element originated from the Latin ‘fluere’, meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère. The isolation was later accomplished and announced by H. Moissan. “F” is the canonical chemical symbol of fluorine. Its atomic number in the periodic table of elements is 9 with location at Period 2 and Group 17, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, the number in the brackets indicating the uncertainty. Tin Fluoride Sputtering Target Application The tin fluoride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc. Tin Fluoride Sputtering Target Packing Our tin fluoride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Thorium Fluoride Sputtering Target Thorium fluoride sputtering target is a type of fluoride ceramic sputtering target composed of thorium and fluorine. Thorium is a chemical element originated from Thor, the Scandinavian god of thunder. It was first mentioned in 1829 and observed by J. Berzelius. “Th” is the canonical chemical symbol of thorium. Its atomic number in the periodic table of elements is 90 with location at Period 7 and Group 3, belonging to the f-block. The relative atomic mass of thorium is 232.03806(2) Dalton, the number in the brackets indicating the uncertainty. Fluorine, also called fluorin, is a chemical element originated from the Latin ‘fluere’, meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère. The isolation was later accomplished and announced by H. Moissan. “F” is the canonical chemical symbol of fluorine. Its atomic number in the periodic table of elements is 9 with location at Period 2 and Group 17, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, the number in the brackets indicating the uncertainty. Thorium Fluoride Sputtering Target Application The thorium fluoride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc. Thorium Fluoride Sputtering Target Packing Our thorium fluoride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

Strontium Fluoride Sputtering Target Description Strontium fluoride sputtering target is a type of fluoride ceramic sputtering target composed of strontium and fluorine. Strontium is a chemical element that originated from Strontian, a small town in Scotland. It was first mentioned in 1787 and observed by W. Cruikshank. The isolation was later accomplished and announced by H. Davy. “Sr” is the canonical chemical symbol of strontium. Its atomic number in the periodic table of elements is 38 with a location at Period 5 and Group 2, belonging to the s-block. The relative atomic mass of strontium is 87.62(1) Dalton, the number in the brackets indicating the uncertainty. Fluorine, also called fluorin, is a chemical element originated from the Latin ‘fluere’, meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère. The isolation was later accomplished and announced by H. Moissan. “F” is the canonical chemical symbol of fluorine. Its atomic number in the periodic table of elements is 9 with location at Period 2 and Group 17, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, the number in the brackets indicating the uncertainty. Strontium Fluoride Sputtering Target Application The strontium fluoride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc. Strontium Fluoride Sputtering Target Packing Our strontium fluoride sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.