PVD (Physical Vapour Deposition) Systems 

CVD (Chemical Vapour Deposition) Systems 

ALD (Atomic Layer Deposition) Systems

PLD (Pulsed Laser Deposition) Systems

MBE (Molecular Beam Evaporation) Systems

Laser Micromachining Systems 
반도체 소재 미세가공 시스템

This group of materials, with conductivities that fall between normal conductors and insulators, can be laser machined with extremely high precision irrespective of whether they fall into the class of materials that form the intrinsic or extrinsic group.

Laser micromachining can be used to process almost all semiconductors with ultra-high accuracy and precision.  This can be particularly important as devices shrink in size where tolerances become ever more demanding. Lasers not only allow drilling of hard semiconductors like Silicon Carbide and Diamond, but also micro cutting where laser kerf widths are significantly reduced compared to conventional dicing or sawing. MORE DETAILS 
 

• Many semiconductor materials e.g. Silicon can not only be drilled and cut but can also be trimmed and the material wafers re-sized.  Wafer resizing can routinely be achieved on wafers up to 300mm.
• In addition, it is possible to mill or thin these semiconductor materials with degrees of precision approaching a few microns.  This can be particularly useful for creating new devices or for semiconductor analysis.

A sample of semiconductors we can machine include:

• Gallium Arsenide | Germanium | Silicon | Silicon Carbide | plus many more...

유전율측정기 (Permittivity, Loss Factor, Tangent Delta)